Title:
配線基板およびその設計方法
Document Type and Number:
Japanese Patent JP6508219
Kind Code:
B2
Abstract:
[Solution] A wiring board is configured to include a first insulating layer 1, a first signal wiring 2 and a second signal wiring 3. The first insulating layer 1 includes fibers 4 having the long axis in a first direction and aligned approximately parallel to each other at a first interval and an insulating material 5 filling gaps between the fibers 4 of the first direction. The first signal wiring 2 is formed approximately parallel to the first direction on the first insulating layer 1. The second signal wiring 3 is formed parallel to the first signal wiring 2 such that the interval between the first and second signal wirings 2 and 3 be approximately an integral multiple of the first interval, and the second signal wiring 3 transmits a differential signal of a signal transmitted on the first signal wiring 2.
More Like This:
Inventors:
Kashiwakura Kazuhiro
Application Number:
JP2016570544A
Publication Date:
May 08, 2019
Filing Date:
January 15, 2016
Export Citation:
Assignee:
NEC
International Classes:
H05K1/02; H05K3/46
Domestic Patent References:
| JP201182271A | ||||
| JP2004221558A | ||||
| JP2006100699A | ||||
| JP2008171834A | ||||
| JP2009164416A | ||||
| JP2011210839A | ||||
| JP2013200850A | ||||
| JP200973946A | ||||
| JP2009164174A | ||||
| JP2009259879A | ||||
| JP2010118523A | ||||
| JP20124351A | ||||
| JP20124507A | ||||
| JP20129730A | ||||
| JP201490027A | ||||
| JP2014130860A |
Foreign References:
| US20040181764 | ||||
| US20060254811 | ||||
| US20090188699 | ||||
| US20110272186 | ||||
| WO2013012053A1 |
Attorney, Agent or Firm:
Masahiko Desk
Naoki Shimosaka
Naoki Shimosaka