Title:
縮合硬化型シリコーン樹脂組成物及び半導体装置
Document Type and Number:
Japanese Patent JP6514148
Kind Code:
B2
Inventors:
Tomoyuki Mizunashi
Hiroyuki Iguchi
Hiroyuki Iguchi
Application Number:
JP2016115686A
Publication Date:
May 15, 2019
Filing Date:
June 09, 2016
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08L83/06; C08K3/22; C08K3/36; C08K9/04; H01L23/29; H01L23/31; H01L33/56
Domestic Patent References:
| JP9316397A | ||||
| JP2009120437A | ||||
| JP2004256586A | ||||
| JP2007182511A | ||||
| JP2003003118A |
Attorney, Agent or Firm:
Mikio Yoshimiya
Toshihiro Kobayashi
Toshihiro Kobayashi