Title:
脆性基板の製造方法
Document Type and Number:
Japanese Patent JP6519638
Kind Code:
B2
Abstract:
A cutter edge (51) is caused to slide to generate a plastic deformation on a first surface (SF1) of a brittle substrate (4), thus forming a trench line (TL). The trench line (TL) is formed so as to obtain a crack-free state in which the brittle substrate (4) seamlessly continues in a direction intersecting the trench line (TL) directly below the trench line (TL). The crack-free state is then maintained. A crack of the brittle substrate (4) in its thickness direction is extended along the trench line (TL) to form a crack line (CL). The brittle substrate (4) is divided along the crack line (CL).
Inventors:
Hiroshi Soyama
Application Number:
JP2017230398A
Publication Date:
May 29, 2019
Filing Date:
November 30, 2017
Export Citation:
Assignee:
Samsung Diamond Industry Co., Ltd.
International Classes:
C03B33/023; B28D1/22; B28D5/00; G02F1/13; G02F1/1333; H01L51/50; H05B33/02
Domestic Patent References:
| JP2012000793A | ||||
| JP2008201629A | ||||
| JP2007331983A | ||||
| JP7240571A |