Title:
造形装置、造形物の造形方法
Document Type and Number:
Japanese Patent JP6520288
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a molding apparatus capable of manufacturing a molded object with high accuracy.SOLUTION: A molding apparatus 1 includes: a mounting part 150 where a sheet produced by binding fibers with a thermoplastic resin is mounted; a cutting part 160 for cutting a first sheet mounted on the mounting part 150 into an effective region to constitute a molded object and an unnecessary region not to constitute the molded object; a removing part 165 for cutting and removing a part of the unnecessary region of the first sheet cut by the cutting part 160; a stacking part 140 for stacking a second sheet on the first sheet in which the unnecessary region is removed by the removing part 165; and a heating part 170 for heating the second sheet to melt at least a part of the thermoplastic resin to adhere the first sheet. The molding apparatus molds a molded object by repeating the steps of cutting a sheet by the cutting part 160, removing an unnecessary region from the sheet by the removing part 165, stacking a sheet by the stacking part 140, and adhering the sheet by the heating part 170.SELECTED DRAWING: Figure 1
Inventors:
▲高▼野 秀裕
Application Number:
JP2015063928A
Publication Date:
May 29, 2019
Filing Date:
March 26, 2015
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
B29C64/223; B29C70/06; B33Y10/00; B33Y30/00
Domestic Patent References:
| JP9155980A | ||||
| JP2001254060A | ||||
| JP2004268591A | ||||
| JP201012736A |
Attorney, Agent or Firm:
Kazuaki Watanabe
Mitsuhiro Isobe
Satoshi Nakai
Hiroki Matsuoka
Mitsuhiro Isobe
Satoshi Nakai
Hiroki Matsuoka