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Title:
差込接続ユニット
Document Type and Number:
Japanese Patent JP6521408
Kind Code:
B2
Inventors:
岡野 直樹
東田 浩典
宮本 秀樹
Application Number:
JP2018027351A
Publication Date:
May 29, 2019
Filing Date:
February 19, 2018
Export Citation:
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Assignee:
テンパール工業株式会社
International Classes:
H02B1/40; H01R13/66; H01R31/02; H02H3/16; H02H5/00
Domestic Patent References:
JP9327119A
JP9147728A
JP9101338A
JP3023275U



 
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