Title:
熱成形可能回路のための熱伝導性誘電体
Document Type and Number:
Japanese Patent JP6523280
Kind Code:
B2
Abstract:
This invention is directed to a polymer thick film thermally conductive thermoformable dielectric composition comprising urethane resin, thermoplastic phenoxy resin, diacetone alcohol and thermally conductive powder. Dielectrics made from the composition can be used in various electronic applications to protect electrical elements and particularly to insulate and protect both the conductive thermoformable silver and the polycarbonate substrate in capacitive switch applications. The thermoformed electrical circuit may be subsequently subjected to an injection molding process.
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Inventors:
Vincenzo Arancho
Jay Robert Dorfman
Jay Robert Dorfman
Application Number:
JP2016531845A
Publication Date:
May 29, 2019
Filing Date:
July 30, 2014
Export Citation:
Assignee:
E.I.DU PONT DE NEMOURS AND COMPANY
International Classes:
C08L75/04; C08K3/22; C08K3/28; C08K3/38; C08K5/07; C08L71/12; H03K17/955
Domestic Patent References:
| JP2013105067A | ||||
| JP2012521486A | ||||
| JP2014531490A |
Foreign References:
| WO2013043619A1 |
Attorney, Agent or Firm:
Patent Business Corporation Tani/Abe Patent Office