Title:
デバイスパッケージの製造方法
Document Type and Number:
Japanese Patent JP6529321
Kind Code:
B2
Inventors:
Katsuhiko Suzuki
Akihito Kawai
Akihito Kawai
Application Number:
JP2015082763A
Publication Date:
June 12, 2019
Filing Date:
April 14, 2015
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L23/12; B24B27/06; H01L21/301; H01L21/56
Domestic Patent References:
| JP2012238793A | ||||
| JP2013058520A |
Foreign References:
| US20110217814 |
Attorney, Agent or Firm:
Akira Matsumoto
Tomohiro Okamoto
Tomohiro Okamoto