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Title:
金属−樹脂の複合体およびその製造方法、並びに電子製品のシェル
Document Type and Number:
Japanese Patent JP6530492
Kind Code:
B2
Abstract:
The present disclosure provides a metal-resin composite and a method of preparing the same. The metal includes titanium or titanium alloy, the composite includes a metal substrate and a resin layer coated on at least part of surface of the metal substrate, a recess is distributed on the part of surface of the metal substrate coated with the resin layer, a part of resin of the resin layer extends downward to fill in the recess, a content of oxygen element on surface of the metal substrate is greater than 1wt%. The method includes dipping a metal substrate in an etching solution containing at least one alkali metal hydroxide so as to form a recess on surface of the metal substrate, and injecting a resin onto surface of the metal substrate after surface treatment sp as to form a resin layer. The metal-resin composite of the present disclosure is suitable for a shell of electronic product.

Inventors:
Jean, Xiao
Tao, Letian
Sun, Jiang
Chen, Liang
Application Number:
JP2017534537A
Publication Date:
June 12, 2019
Filing Date:
October 29, 2015
Export Citation:
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Assignee:
BYD COMPANY LIMITED
International Classes:
B32B15/08; B29C45/14; B32B3/30; C23F1/38
Domestic Patent References:
JP2010274600A
JP2009266195A
JP2015510464A
JP2015509557A
Foreign References:
WO2010016485A1
WO2009031632A1
Attorney, Agent or Firm:
Seiichi Inoue