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Title:
熱硬化性シリコーン樹脂組成物およびその成形体を使用した光半導体装置
Document Type and Number:
Japanese Patent JP6540620
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a thermosetting silicone resin composition which gives a cured product that is excellent in toughness, particularly, flexibility, and improves warpage characteristics by reduction in elasticity, and to provide an optical semiconductor device using the same.SOLUTION: A thermosetting silicone resin composition contains (A) a condensation reaction type resin-like organopolysiloxane being a solid at 25°C of 70-98 pts.mass, (B) organopolysiloxane which has a straight chain diorganopolysiloxane residue and has at least one cyclohexyl group or phenyl group in one molecule of 2-30 pts.mass, (total of components (A) and (B) is 100 pts.mass), (C) acrylic modified silicon resin powder of 1-30 pts.mass, (D) an inorganic filler: 300-1,200 pts.mass, and (E) an organic metal condensation catalyst: 0.01-10 pts.mass.SELECTED DRAWING: None

Inventors:
Yoshihiro Tsutsumi
Tadashi Tomita
Application Number:
JP2016135659A
Publication Date:
July 10, 2019
Filing Date:
July 08, 2016
Export Citation:
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Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08L83/06; C08K3/00; C08L83/04; C08L83/07; H01L23/29; H01L23/31; H01L31/12; H01L33/56
Domestic Patent References:
JP2012121992A
JP2000186279A
Foreign References:
WO2015093329A1
Attorney, Agent or Firm:
Mamoru Ushiki