Title:
半導体装置およびその製造方法
Document Type and Number:
Japanese Patent JP6542072
Kind Code:
B2
Inventors:
Atsunobu Isobayashi
Akihiro Kajita
Tadashi Sakai
Akihiro Kajita
Tadashi Sakai
Application Number:
JP2015166690A
Publication Date:
July 10, 2019
Filing Date:
August 26, 2015
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
H01L21/768; H01L21/3205; H01L23/532
Domestic Patent References:
| JP2014157923A | ||||
| JP2014183210A | ||||
| JP2004534662A | ||||
| JP2016174039A |
Attorney, Agent or Firm:
Suzue International Patent Office