Title:
ヒートポンプ装置および給湯装置
Document Type and Number:
Japanese Patent JP6543072
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a heat pump device and a hot water supply device that can increase the recovery efficiency of released heat to increase the efficiency of a heat pump cycle.SOLUTION: A heat pump device comprises: a compressor 101; a water-refrigerant heat exchanger 102; an expansion valve; an evaporator 104; a refrigerant pipe that circulates a refrigerant; and a waste heat recovery heat exchanger 106A provided in the middle of a suction pipe 10 that connects the evaporator 104 and the compressor 101. The waste heat recovery heat exchanger 106A is arranged opposite to a surface along a longitudinal direction of one of the compressor 101, the water-refrigerant heat exchanger 102, the expansion valve, and the refrigerant flow passage.SELECTED DRAWING: Figure 3
Inventors:
Watabe Michiharu
Tomohiro Komatsu
Hiroshi Yoneda
Tetsuya Kitamura
Koichi Sakamoto
Tomohiro Komatsu
Hiroshi Yoneda
Tetsuya Kitamura
Koichi Sakamoto
Application Number:
JP2015082268A
Publication Date:
July 10, 2019
Filing Date:
April 14, 2015
Export Citation:
Assignee:
Hitachi Global Life Solutions, Inc.
International Classes:
F25B1/00; F24H4/00
Domestic Patent References:
JP54132839A | ||||
JP2010056A | ||||
JP5099750U |
Foreign References:
CN202835789U | ||||
CN102645021A | ||||
WO2013045363A1 | ||||
KR1020050098153A | ||||
KR1020140093833A | ||||
CN203572110U | ||||
CN103344068A | ||||
CN202927977U | ||||
CN207422665U |
Attorney, Agent or Firm:
Isono International Patent and Trademark Office