Title:
電子装置
Document Type and Number:
Japanese Patent JP6543226
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To solve such a problem that, in an electronic device, substrate cost increases and heat dissipation decreases.SOLUTION: The area of solder regions 10 can be reduced by providing four places of the solder regions 10. Through thermal vias 9 are arranged in a thermal via region 11 adjacent to the solder regions 10. The through thermal vias 9 are arranged around the solder regions 10. Thus, flux vaporized when a solder is melted in a reflow furnace is less likely to remain in the solder. In addition, there is provided an electronic device low in cost and excellent in heat dissipation using a substrate 6 including the through thermal vias 9.SELECTED DRAWING: Figure 4
Inventors:
Kawakita Shinya
Yoshio Kawai
Yoshio Kawai
Application Number:
JP2016152727A
Publication Date:
July 10, 2019
Filing Date:
August 03, 2016
Export Citation:
Assignee:
Hitachi Automotive Systems, Ltd.
International Classes:
H01L23/36; H01L23/12; H05K1/02
Domestic Patent References:
| JP2002026468A | ||||
| JP2014140002A | ||||
| JP2012099682A | ||||
| JP2006147723A | ||||
| JP2006080168A | ||||
| JP2010267869A |
Foreign References:
| US20030234441 |
Attorney, Agent or Firm:
Patent Business Corporation Sunnext International Patent Office