Title:
ウエハの接合方法及び接合装置
Document Type and Number:
Japanese Patent JP6544722
Kind Code:
B2
Inventors:
Akira Yamauchi
Application Number:
JP2015214012A
Publication Date:
July 17, 2019
Filing Date:
October 30, 2015
Export Citation:
Assignee:
Bond Tech Co., Ltd.
International Classes:
H01L21/02; B23K20/00; B23K20/24
Domestic Patent References:
| JP2007115825A | ||||
| JP2014103291A | ||||
| JP2009177088A | ||||
| JP2011187716A | ||||
| JP2014007325A |
Foreign References:
| WO2014157321A1 |
Attorney, Agent or Firm:
Kimura Mitsuru
Taiji Morikawa
Shiro Ryutake
Yasushi Sakakibara
Taiji Morikawa
Shiro Ryutake
Yasushi Sakakibara