Title:
コンフォーマル電子デバイスの封入方法
Document Type and Number:
Japanese Patent JP6549150
Kind Code:
B2
Abstract:
Encapsulated conformal electronic devices, encapsulated conformal integrated circuit (IC) sensor systems, and methods of making and using encapsulated conformal electronic devices are presented herein. A conformal integrated circuit device is disclosed which includes a flexible substrate with electronic circuitry attached to the flexible substrate. A flexible encapsulation layer is attached to the flexible substrate. The flexible encapsulation layer encases the electronic circuitry between the flexible substrate and the encapsulation layer. For some configurations, the encapsulation layer and flexible substrate arc fabricated from stretchable and bendable non-conductive polymers. The electronic circuitry may comprise an integrated circuit sensor system with multiple device islands that are electrically and physically connected via a plurality of stretchable electrical interconnects.
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Inventors:
McMahon, Nicholas
Wang, Shan Yang
Erolampi, Brian
Keane, Brian Di.
Garlock, David G.
Wang, Shan Yang
Erolampi, Brian
Keane, Brian Di.
Garlock, David G.
Application Number:
JP2016562729A
Publication Date:
July 24, 2019
Filing Date:
January 06, 2015
Export Citation:
Assignee:
MC10,INC.
International Classes:
H01L23/28; H01L21/56
Domestic Patent References:
| JP9201338A | ||||
| JP2007042829A | ||||
| JP2012515436A | ||||
| JP2011082050A | ||||
| JP2012134272A |
Attorney, Agent or Firm:
Makoto Onda
Hironobu Onda
Atsushi Honda
Hironobu Onda
Atsushi Honda