切削装置 - Disco Co., Ltd.

Title:

切削装置

Document Type and Number:

Japanese Patent JP6556066

Kind Code:

B2

Abstract:

The invention provides a cutting device. The cutting device 2 is provided with a retaining working bench 10 used to retain a processed object 11. The retaining working bench comprises a retaining tool 14 and a tool base 12. The retaining tool is provided with a retaining surface 14a, which is used to retain the processed object; a plurality of retracting grooves 14c used for the cutting tool, which are disposed on the position of the segmentation predetermined line 19 of the processed object retained by the retaining surface; a plurality of absorption holes 14d, which are disposed in the various areas divided by the retracting grooves of the cutting tool. The tool base is provided with a negative pressure transmission part 12b, which is used to transmit negative pressure to the absorption holes; a carrying part (12a), which is used to carry the retaining tool. The retaining tool is provided with a plurality of cutting liquid overflow grooves 14e, which are adjacent to the retracting grooves used for the cutting tool in a corresponding way, and are provided with bottom surfaces 14g lower than the bottom surfaces 14f of the retracting grooves used for the cutting tool.

Inventors:

Satoshi Sawaki
Hideyuki Yamado

Application Number:

JP2016022950A

Publication Date:

August 07, 2019

Filing Date:

February 09, 2016

Export Citation:

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