Title:
基板処理装置及び基板処理方法
Document Type and Number:
Japanese Patent JP6556074
Kind Code:
B2
Abstract:
Disclosed is a substrate processing apparatus including: a substrate holding unit configured to hold a substrate; a processing container configured to accommodate the substrate holding unit; a cover unit configured to load the substrate holding unit therein and to open or close an opening provided in one end of the processing container; a seal member configured to seal a gap between the end of the processing container and the cover unit; a driving mechanism configured to move the cover unit; and a controller configured to control an operation of the driving mechanism. The controller controls the operation of the driving mechanism such that the cover unit performs an intermittent operation of alternately repeating moving and stopping when opening the opening in the processing container.
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Inventors:
Kinoshita Morizen
Yuu Kumada
Hiroyuki Matsuyoshi
Yuu Kumada
Hiroyuki Matsuyoshi
Application Number:
JP2016039543A
Publication Date:
August 07, 2019
Filing Date:
March 02, 2016
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/205; H01L21/22; H01L21/324; H01L21/677
Domestic Patent References:
| JP2011166112A | ||||
| JP2005056905A | ||||
| JP2002246379A |
Foreign References:
| WO2007102426A1 | ||||
| WO2016052023A1 |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito