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Patent Searching and Data


Title:
半導体集積回路装置および電子装置
Document Type and Number:
Japanese Patent JP6557517
Kind Code:
B2
Inventors:
鶴丸 誠
Application Number:
JP2015115540A
Publication Date:
August 07, 2019
Filing Date:
June 08, 2015
Export Citation:
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Assignee:
ルネサスエレクトロニクス株式会社
International Classes:
G01K7/01; G01K7/00; H02H5/04; H02M7/48
Domestic Patent References:
JP1133586A
JP3075303B2
Foreign References:
WO2014091852A1
Attorney, Agent or Firm:
ポレール特許業務法人