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Title:
モジュール式経皮弁構造体及び送達方法
Document Type and Number:
Japanese Patent JP6559048
Kind Code:
B2
Abstract:
To provide a modular percutaneous prosthetic valve device for implantation in a patient.SOLUTION: The valve device is designed as two or more modules to be delivered unassembled and combined into an assembled valve device in the body, e.g., in the body at or near the site where implantation occurs. The two or more modules may be a support structure and a valve assembly. The valve assembly may be formed from two or more valve sections. Because the valve device of the invention is deliverable as modules, it may have a smaller delivery diameter than pre-assembled percutaneous valves and permits use of a delivery device of reduced diameter. Delivering the valve device as modules increases the flexibility of the valve device during delivery, compared to percutaneous valve devices in the art.SELECTED DRAWING: Figure 1

Inventors:
Victor Yoram
Victor Jacob
Application Number:
JP2015217325A
Publication Date:
August 14, 2019
Filing Date:
November 05, 2015
Export Citation:
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Assignee:
VALVE MEDICAL LTD
International Classes:
A61F2/24; A61F2/08
Domestic Patent References:
JP2007516055A
Attorney, Agent or Firm:
Masaki Hirota
Seiji Ozawa
Yusaku Tokai
Makoto Horiuchi
Masako Yamauchi