Title:
発電モジュールおよび配線基板
Document Type and Number:
Japanese Patent JP6565912
Kind Code:
B2
Abstract:
This wiring module includes: a wiring substrate; a base portion at which the wiring substrate is placed; and an adhesive layer configured to adhere the wiring substrate to the base portion, wherein the wiring substrate includes: a land portion configured to have a power generating element mounted thereto; and a wire portion configured to be electrically connected to the power generating element, the adhesive layer has: a land adhesion region configured to adhere the land portion to the base portion; and a wire adhesion region configured to adhere the wire portion to the base portion, and a width of the wire adhesion region is smaller than a width of the land adhesion region.
Inventors:
Kazumasa Toriya
Takashi Iwasaki
Yoichi Nagai
Koji Mori
Kenji Saito
Mikami base
Kenji Yamana
Takashi Iwasaki
Yoichi Nagai
Koji Mori
Kenji Saito
Mikami base
Kenji Yamana
Application Number:
JP2016532924A
Publication Date:
August 28, 2019
Filing Date:
July 06, 2015
Export Citation:
Assignee:
Sumitomo Electric Industries, Ltd.
International Classes:
H01L31/05
Domestic Patent References:
| JP2013080760A | ||||
| JP2013084855A | ||||
| JP2007019334A |
Foreign References:
| US20120279551 |
Attorney, Agent or Firm:
Patent Corporation Wandee ip Partners