Title:
金属微粒子分散液、焼結導電体の製造方法及び導電接続部材の製造方法
Document Type and Number:
Japanese Patent JP6567263
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a metal fine particle dispersion capable of providing sintered film excellent in conductivity even with sintering under inactive atmosphere.SOLUTION: The copper fine particle dispersion is coated by a high polymer dispersant (D) and contains metal fine particle (P) consisting of at least one kind selected from a group consisting of a metal element, an alloy and a metallic compound and having average primary particle diameter of 5 nm to 500 nm of 20 to 70 wt.%, an organic solvent consisting of primary alcohol or secondary alcohol (S) of 25 to 79.5 wt.% and organic peroxide (R) of 0.5 to 5 wt.%.SELECTED DRAWING: None
Inventors:
Norza friza arifin
Hidemichi Fujiwara
Tomohiro Ishii
Hidemichi Fujiwara
Tomohiro Ishii
Application Number:
JP2014210916A
Publication Date:
August 28, 2019
Filing Date:
October 15, 2014
Export Citation:
Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
International Classes:
B22F1/02; B22F1/00; B22F9/00; H01B1/00; H01B1/22; H01B5/14
Domestic Patent References:
| JP2010080438A | ||||
| JP2013082967A | ||||
| JP2013504148A | ||||
| JP6325613A | ||||
| JP2010013721A |
Foreign References:
| WO2014022284A1 |
Attorney, Agent or Firm:
Einzel Felix-Reinhard
Ueshima
Ueshima