Title:
半導体装置
Document Type and Number:
Japanese Patent JP6571446
Kind Code:
B2
Inventors:
Takahisa Yoshihisa
Fuwa Yasuhiro
Fuwa Yasuhiro
Application Number:
JP2015158844A
Publication Date:
September 04, 2019
Filing Date:
August 11, 2015
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
H01L21/60; H01L23/12; H01L23/14
Domestic Patent References:
| JP2014209091A | ||||
| JP2005252162A | ||||
| JP2006237151A | ||||
| JP2009206334A | ||||
| JP2001257310A |
Foreign References:
| US20120104623 |
Attorney, Agent or Firm:
Minoru Yoshida
Nao Usui
Nao Usui