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Patent Searching and Data


Title:
端末支持装置の取付構造
Document Type and Number:
Japanese Patent JP6578087
Kind Code:
B2
Inventors:
山本 伸行
Application Number:
JP2014114307A
Publication Date:
September 18, 2019
Filing Date:
June 02, 2014
Export Citation:
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Assignee:
株式会社ハイレックスコーポレーション
International Classes:
F16C1/10
Domestic Patent References:
JP2006503241A
Foreign References:
US6105458
DE2261933A
Attorney, Agent or Firm:
特許業務法人朝日奈特許事務所