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Patent Searching and Data


Title:
多孔性配位高分子
Document Type and Number:
Japanese Patent JP6578704
Kind Code:
B2
Inventors:
小林 渉
前浜 誠司
Application Number:
JP2015073357A
Publication Date:
September 25, 2019
Filing Date:
March 31, 2015
Export Citation:
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Assignee:
東ソー株式会社
International Classes:
C07F3/02; B01D53/02; B01J20/26; B01J20/28; B01J20/30; C01B32/50; C08G79/00
Domestic Patent References:
JP2002018226A
JP2002191924A
JP2005528204A
JP2007534896A
JP2009537695A
Foreign References:
WO2014028574A1
WO2014045135A1
US20080121105