Title:
熱硬化性樹脂組成物及びこれを用いたプリプレグ、積層板、プリント配線板
Document Type and Number:
Japanese Patent JP6578773
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition excellent in dielectric property as well as excellent in metal foil adhesion and heat resistance, a prepreg, a laminate and a printed wring board using the same.SOLUTION: A thermosetting resin composition contains: a polyimide curing agent (A) which is a polyimide compound obtained by reacting a maleimide compound (a) having at least 2 N-substituted maleimide compounds in a molecule, an aniline compound (b) having 2 aromatic amino groups in a molecule and an aminophenol compound (c) having an aromatic amino group and at least an aromatic hydroxyl group in a molecule, making the component (a) excess over the components (b) and (c), and has specific weight average molecular weight defined by a concept as binding degree; an epoxy resin (B); and a styrene-maleic acid copolymer (C). The binding degree satisfies the following relationship of binding degree=weight average molecular weight/preparing average molecular weight.SELECTED DRAWING: None
Inventors:
Hiroaki Yoshino
Makoto Yanagida
Makoto Yanagida
Application Number:
JP2015137250A
Publication Date:
September 25, 2019
Filing Date:
July 08, 2015
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C08G59/40; B32B17/04; C08J5/24; C08K5/3415; C08L25/08; C08L63/00
Domestic Patent References:
| JP2012111930A | ||||
| JP2008111096A | ||||
| JP2016017091A |
Foreign References:
| WO2008041453A1 |
Attorney, Agent or Firm:
Tamotsu Otani
Kenichi Hirasawa
Kenichi Hirasawa