Title:
プリント配線基板、および半導体装置
Document Type and Number:
Japanese Patent JP6579886
Kind Code:
B2
Inventors:
Hiroshi Takasugi
Shin Teraki
Shin Teraki
Application Number:
JP2015188938A
Publication Date:
September 25, 2019
Filing Date:
September 25, 2015
Export Citation:
Assignee:
Namics Co., Ltd.
International Classes:
H05K1/05; H01L23/12; H01L23/36; H05K1/03
Domestic Patent References:
| JP2013243398A | ||||
| JP2005281509A | ||||
| JP2013008886A | ||||
| JP2013023503A | ||||
| JP2015130416A |
Foreign References:
| WO2005054388A1 |
Attorney, Agent or Firm:
Yusuke Watanabe