Title:
研磨装置の構成部品用のカバー、研磨装置の構成部品、および、研磨装置
Document Type and Number:
Japanese Patent JP6580178
Kind Code:
B2
Abstract:
There is provided a cover to which a polishing liquid is less likely to stick and solidify. The cover for a component of a polishing apparatus for polishing substrates is provided with a locking mechanism disposed inside the cover and configured to latch together a main body of the component and the cover. An external surface of the cover exposed to the outside has no recessed portion, and has no horizontal plane, except on the top portion of the cover.
Inventors:
Takeshi Shinkai
Chuichi Sone
Hideo Aizawa
Hiroshi Aono
Chuichi Sone
Hideo Aizawa
Hiroshi Aono
Application Number:
JP2018031845A
Publication Date:
September 25, 2019
Filing Date:
February 26, 2018
Export Citation:
Assignee:
Ebara Corporation
International Classes:
B24B55/06; B23Q11/08; B24B37/10; H01L21/304
Domestic Patent References:
| JP10225811A | ||||
| JP2004356517A | ||||
| JP2002058543A | ||||
| JP2003136364A | ||||
| JP2013141735A | ||||
| JP2007168039A |
Foreign References:
| KR1020060124501A | ||||
| US6315651 |
Attorney, Agent or Firm:
Shinjiro Ono
Toru Miyamae
Yukio Kanegae
Makoto Watanabe
Toru Miyamae
Yukio Kanegae
Makoto Watanabe