Title:
研磨パッド、研磨パッドを用いた研磨方法及び該研磨パッドの使用方法
Document Type and Number:
Japanese Patent JP6582057
Kind Code:
B2
Abstract:
Provided is a polishing pad having a resin foam article composed of a thermoplastic resin with excellent re-polishing characteristics, the polishing pad being capable of eliminating or dramatically shortening pre-polishing time and realizing simple polishing, and being capable of highly reliable and efficient polishing by continuous polishing at an excellent polishing speed from an initial stage. The polishing pad (1, 2) is composed of a highly rigid thermoplastic hard resin foam article having a three-dimensional cell structure partitioned by cell walls so as to have a plurality of cells and partitions in which these cells are mutually independent. The polishing pad has a structure in which the tensile strength is 50-90 MPa, bending strength is 90-140 MPa, the tensile modulus of elasticity and the flexural elastic modulus are both 2400 MPa or greater, the average cell diameter is 4-50 μm, the average cell wall thickness is 1-5 μm, and the ratio of the average cell diameter to the average cell wall thickness is in a range of 4-10, the values being the mechanical characteristics of the wall section of the cell walls as expressed by the mechanical characteristics of the resin sheet material prior to foaming.
Inventors:
Yokotoshi Toshitoshi
Shunji Yamamoto
Tetsuji Kubota
Toda Sadayuki
Mitsuo Masuda
Shunji Yamamoto
Tetsuji Kubota
Toda Sadayuki
Mitsuo Masuda
Application Number:
JP2017547283A
Publication Date:
September 25, 2019
Filing Date:
October 29, 2015
Export Citation:
Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
International Classes:
B24B37/24; B24B37/00; B24B53/017; H01L21/304
Domestic Patent References:
| JP2011067945A | ||||
| JP2005532176A | ||||
| JP2009113196A | ||||
| JP2000232082A | ||||
| JP2001105300A |
Attorney, Agent or Firm:
Einzel Felix-Reinhard
Junichi Maekawa
Hiroyasu Ninomiya
Ueshima
Shuichi Sumiyoshi
Junichi Maekawa
Hiroyasu Ninomiya
Ueshima
Shuichi Sumiyoshi