Title:
電子部品搬送装置
Document Type and Number:
Japanese Patent JP6582623
Kind Code:
B2
Inventors:
Kakukata Masaru
Naoto Tanaka
Hajime Mitsui
Naoto Tanaka
Hajime Mitsui
Application Number:
JP2015133334A
Publication Date:
October 02, 2019
Filing Date:
July 02, 2015
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01G13/00
Domestic Patent References:
JP2011018698A | ||||
JP10284355A | ||||
JP2012134498A |
Attorney, Agent or Firm:
Etsushi Kotani
Masataka Otani
Kazutoshi Nakayama
Masataka Otani
Kazutoshi Nakayama