Title:
発光モジュール
Document Type and Number:
Japanese Patent JP6584746
Kind Code:
B2
Abstract:
One embodiment of the present invention relates to a light-emitting device comprising an insulating surface; a lower electrode over the insulating surface; a protrusion over the insulating surface having a sidewall sloping toward the lower electrode; a light-transmitting partition overlapping with an end portion of the lower electrode and the sidewall of the protrusion; and a light-emitting element including the lower electrode, an upper electrode overlapping with the lower electrode, and a layer containing a light-emitting organic compound between the lower electrode and the upper electrode. In the light-emitting device, the sidewall of the protrusion can reflect light emitted from the light-emitting element. As a result, the light-emitting device that has reduced power consumption is provided.
Inventors:
Shunpei Yamazaki
Toshio Ikeda
Masataka Nakata
Masami Nagasawa
Yukiharu Ono
Toshio Ikeda
Masataka Nakata
Masami Nagasawa
Yukiharu Ono
Application Number:
JP2014081578A
Publication Date:
October 02, 2019
Filing Date:
April 11, 2014
Export Citation:
Assignee:
Semiconductor Energy Laboratory Co., Ltd.
International Classes:
H05B33/24; H01L51/50; H05B33/04; H05B33/12; H05B33/22; H05B33/26
Domestic Patent References:
| JP2012221811A | ||||
| JP2012204261A | ||||
| JP2004119197A | ||||
| JP2011081998A | ||||
| JP2009070814A | ||||
| JP2010108706A | ||||
| JP2013045766A |
Foreign References:
| US20090174320 | ||||
| WO2013038971A1 |