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Title:
離型層付き金属箔、積層体、プリント配線板、半導体パッケージ、電子機器、積層体の製造方法及びプリント配線板の製造方法
Document Type and Number:
Japanese Patent JP6588290
Kind Code:
B2
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Inventors:
Akimasa Moriyama
Masashi Ishii
Application Number:
JP2015187538A
Publication Date:
October 09, 2019
Filing Date:
September 25, 2015
Export Citation:
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Assignee:
JX Nippon Mining & Metals Co., Ltd.
International Classes:
H05K3/38; B32B9/00; B32B15/08; B32B15/20; C23C22/52; H01B5/02; H01B5/14; H01B13/00
Domestic Patent References:
JP2015106629A
JP2006093625A
JP2014049645A
JP2015109351A
JP2015090980A
Foreign References:
WO2014054811A1
Attorney, Agent or Firm:
Axis International Patent Business Corporation



 
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