Title:
積層チップ電子部品、その実装基板及び包装体
Document Type and Number:
Japanese Patent JP6593424
Kind Code:
B2
Abstract:
A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; external electrodes formed to cover both end portions of the ceramic body in a length direction; an active layer in which the internal electrodes are disposed in an opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; and upper and lower cover layers formed on upper and lower portions of the active layer in a thickness direction, the lower cover layer having a thickness greater than that of the upper cover layer.
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Inventors:
Lee Seung Chul
Kim Woo Sup
Kim Dong Gun
Kim Kyung Jun
Lee Kyu Ho
Kim Woo Sup
Kim Dong Gun
Kim Kyung Jun
Lee Kyu Ho
Application Number:
JP2017237547A
Publication Date:
October 23, 2019
Filing Date:
December 12, 2017
Export Citation:
Assignee:
Samsung Electro-Mechanics Co., Ltd.
International Classes:
H01G4/30; H01G2/06; H01G2/24; H01G4/12; H01G13/00
Domestic Patent References:
| JP2009200168A | ||||
| JP58057723A | ||||
| JP6215978A | ||||
| JP62124835U | ||||
| JP2009071106A | ||||
| JP2002299193A | ||||
| JP2000068148A | ||||
| JP2011108827A | ||||
| JP2012248581A |
Attorney, Agent or Firm:
Longhua International Patent Service Corporation