Title:
穿孔装置
Document Type and Number:
Japanese Patent JP6601381
Kind Code:
B2
Inventors:
Seiji Kamicho
Application Number:
JP2016246460A
Publication Date:
November 06, 2019
Filing Date:
December 20, 2016
Export Citation:
Assignee:
Kyocera Document Solutions Co., Ltd.
International Classes:
B65H37/04; G03G15/00
Domestic Patent References:
| JP2008100785A | ||||
| JP2001275374A | ||||
| JP2015211502A |
Attorney, Agent or Firm:
Shiroyuki Hori
Yukihiko Maejima
Akira Hasegawa
Daiyu Murakami
Taku Ogawa
Yukihiko Maejima
Akira Hasegawa
Daiyu Murakami
Taku Ogawa