Title:
変性樹脂及びそれを含む硬化性樹脂組成物
Document Type and Number:
Japanese Patent JP6601634
Kind Code:
B2
Abstract:
Provided are: a modified resin which exhibits high bonding strength if base materials are bonded with each other by means of this modified resin; and a curable resin composition which contains this modified resin. A modified resin which is obtained by reacting an epoxy resin, a modifying compound that is an indispensable component, and a (meth)acrylic acid anhydride that is an optional component, and wherein the modifying compound is composed of one or more compounds selected from the group consisting of carboxylic acids (excluding (meth)acrylic acids), carboxylic acid anhydrides (excluding (meth)acrylic acid anhydrides), alcohols and thiols; and a curable resin composition which contains this modified resin.
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Inventors:
Usui Daiaki
Kensuke Miyazaki
Daisuke Shiraishi
Ryuichi Yoshikawa
Kensuke Miyazaki
Daisuke Shiraishi
Ryuichi Yoshikawa
Application Number:
JP2017070658A
Publication Date:
November 06, 2019
Filing Date:
March 31, 2017
Export Citation:
Assignee:
Kyoritsu Chemical Industry Co., Ltd.
International Classes:
C08G59/14; C08F299/02; C08G59/20; G02F1/1339
Domestic Patent References:
JP2004043575A | ||||
JP9100438A | ||||
JP56059819A | ||||
JP56059803A | ||||
JP2003107693A | ||||
JP62184014A | ||||
JP2018172483A |
Attorney, Agent or Firm:
Patent business corporation Tsukuni