Title:
銅ナノ粒子、それを用いた銅ナノ粒子ペースト、銅ナノ粒子コアシェル金属、銅ナノ粒子製造装置、銅ナノ粒子の製造方法
Document Type and Number:
Japanese Patent JP6603838
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide copper nanoparticles inexpensively produced with a high yield, a copper nanoparticle paste using the above particles, a copper nanoparticle core-shell metal, an apparatus for producing copper nanoparticles, and a method for producing copper nanoparticles.SOLUTION: Continuous production of copper nanoparticles is achieved while preventing adhesion of a mirror or a precipitate, by dissolving copper hydroxide and copper nitrate in the same solvent, mixing with, as a dispersant, a polycarboxylic acid and diethylene glycol monobutyl ether (C8H18O3), or 2-ethylhexanol (C8H18O) and dodecane (C12H26), further mixing hydrazine as a reductant of a copper salt, and allowing the resultant reaction liquid to pass through a cavity for microwave irradiation.SELECTED DRAWING: Figure 3
Inventors:
Kenichi Watanabe
Hidekazu Koda
Hidekazu Koda
Application Number:
JP2018073863A
Publication Date:
November 13, 2019
Filing Date:
April 06, 2018
Export Citation:
Assignee:
Shinko Chemical Industry Co., Ltd.
International Classes:
B22F9/00; B22F1/00; B22F1/02; B22F9/24; H01B1/22; H01B13/00
Domestic Patent References:
| JP2015047535A |