Title:
電子を用いた超高速検査装置および電子を用いた超高速検査方法
Document Type and Number:
Japanese Patent JP6604751
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a very high inspection device using electrons and a very high inspecting method using electrons, the device being used for acquiring electronic distribution information reflecting a three-dimensional structure of a surface of a sample and for conducting an inspection of finding pattern defects at high speed.SOLUTION: The very high inspection device includes: irradiation means which irradiates a specific region of a sample with electrons; an electron detector 6 which detects angle distribution information, intensity distribution information, or energy distribution information on electrons discharged or reflected when the electrons have been applied to the specific region; checking means which checks at least one of the angle distribution information, intensity distribution information, and energy distribution information detected by the electron detector 6 against reference information on the specific region of the sample; and outputting means which outputs results obtained by the checking means (including position coordinates of detected defects if necessary).SELECTED DRAWING: Figure 1
Inventors:
Keizo Yamada
Application Number:
JP2015122678A
Publication Date:
November 13, 2019
Filing Date:
June 18, 2015
Export Citation:
Assignee:
Holon Co., Ltd.
International Classes:
G01N23/2251; G01B15/08; G01N23/203; H01J37/244; H01J37/28; H01L21/66
Domestic Patent References:
| JP2008193119A | ||||
| JP2008117690A | ||||
| JP2005101619A | ||||
| JP2007207688A |
Attorney, Agent or Firm:
Morihiro Okada