Title:
Ｓｍ系ボンド磁石用樹脂コンパウンドおよびそれを用いたボンド磁石並びにＳｍ系ボンド磁石の製造方法
Document Type and Number:
Japanese Patent JP6606908
Kind Code:
B2
Inventors:
Teruo Ito
Shitayama Yudai
Chio Ishihara
Shitayama Yudai
Chio Ishihara
Application Number:
JP2015151384A
Publication Date:
November 20, 2019
Filing Date:
July 31, 2015
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
H01F1/055; C08G59/40; C08K3/00; C08L63/00; H01F1/06; H01F41/02
Domestic Patent References:
| JP62046504A | ||||
| JP8109244A | ||||
| JP58122705A | ||||
| JP49118798A | ||||
| JP2003342354A | ||||
| JP2005054060A | ||||
| JP6322073A | ||||
| JP2011099086A |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Yoshinori Shimizu
Hiroyuki Hirano