Title:
配索材の導体接続構造
Document Type and Number:
Japanese Patent JP6607896
Kind Code:
B2
Abstract:
A conductor connection structure for routing members includes a routing member in which an outer circumferential surface of a long conductor except conductor end face portions of both ends in a longitudinal direction is coated and insulated, and a junction member having a plurality of junction end face portions and made of a conductive metal. One of the junction end face portions is metallurgically bonded to one of the conductor end face portions.
Inventors:
Masahito Ozaki
Goro Nakamura
Goro Nakamura
Application Number:
JP2017180345A
Publication Date:
November 20, 2019
Filing Date:
September 20, 2017
Export Citation:
Assignee:
Yazaki Corporation
International Classes:
H01R4/02; H01R4/34; H01R4/38; H01R4/58
Domestic Patent References:
JP11297372A | ||||
JP2016219218A | ||||
JP6009331U | ||||
JP3008866U |
Attorney, Agent or Firm:
Patent business corporation glory patent office