Title:
半導体装置の製造方法、基板処理装置およびプログラム
Document Type and Number:
Japanese Patent JP6608516
Kind Code:
B2
Inventors:
Kamakura Tsukasa
Takaaki Noda
Takaaki Noda
Application Number:
JP2018236993A
Publication Date:
November 20, 2019
Filing Date:
December 19, 2018
Export Citation:
Assignee:
Kokusai electric inc.
International Classes:
H01L21/316; C23C16/42; H01L21/31
Domestic Patent References:
| JP2011204751A | ||||
| JP2010219500A | ||||
| JP2008124474A | ||||
| JP9134919A | ||||
| JP2012114223A |
Foreign References:
| WO2015045163A1 |
Attorney, Agent or Firm:
Fukuoka Masahiro
Aniya Setsuo
Aniya Setsuo