Title:
化合物半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP6609926
Kind Code:
B2
Inventors:
Yuichi Minoura
Application Number:
JP2015009158A
Publication Date:
November 27, 2019
Filing Date:
January 21, 2015
Export Citation:
Assignee:
富士通株式会社
International Classes:
H01L21/338; H01L21/28; H01L21/283; H01L21/3065; H01L21/316; H01L21/336; H01L29/778; H01L29/78; H01L29/812
Domestic Patent References:
| JP2014179389A | ||||
| JP2014236105A | ||||
| JP2013004735A | ||||
| JP2014135439A |
Foreign References:
| WO2011039800A1 |
Attorney, Agent or Firm:
Kenji Doi
Hayashi Tsunetoku
Manabe Kiyoshi
Hayashi Tsunetoku
Manabe Kiyoshi