Title:
基板処理装置の管理方法、及び基板処理システム
Document Type and Number:
Japanese Patent JP6611652
Kind Code:
B2
Abstract:
A measurement processing process S103 of measuring a cut width of a film based on an image obtained by imaging, with an imaging unit 270, a peripheral portion of a substrate which is processed based on a substrate processing recipe; a creation process S602 of creating a management list in which a set value of the cut width of the film, a measurement value of the cut width of the film measured through the measurement processing process and time information at which the measurement result is obtained are correlated; an analysis process S603 (S606) of analyzing a state of the processed substrate based on the created management list; and a notification process S605 (S608, S609) of making a preset notification to a user based on an analysis result obtained through the analysis process are provided.
Inventors:
Amano Yoshifumi
Satoshi Morita
Ryoji Ikebe
Miyamoto Isamu
Satoshi Morita
Ryoji Ikebe
Miyamoto Isamu
Application Number:
JP2016068212A
Publication Date:
November 27, 2019
Filing Date:
March 30, 2016
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/306; H01L21/304
Domestic Patent References:
| JP2008244328A | ||||
| JP2014091105A | ||||
| JP2012146774A | ||||
| JP2013077639A | ||||
| JP2010165876A |
Attorney, Agent or Firm:
Mihiro Uchino