Title:
フォトニック機能を分割するための複合デバイス、およびその作製方法
Document Type and Number:
Japanese Patent JP6612219
Kind Code:
B2
Abstract:
A method for fabricating a photonic composite device for splitting functionality across materials comprises providing a composite device having a platform and a chip bonded in the platform. The chip is processed comprising patterning, etching, deposition, and/or other processing steps while the chip is bonded to the platform. The chip is used as a gain medium and the platform is at least partially made of silicon.
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Inventors:
Clathric, Stefan Bee.
Dallasse, John
Mizurahi, Amit
Creasso, Timothy
Makena, Elton
Span, John Wye.
Dallasse, John
Mizurahi, Amit
Creasso, Timothy
Makena, Elton
Span, John Wye.
Application Number:
JP2016521282A
Publication Date:
November 27, 2019
Filing Date:
October 09, 2014
Export Citation:
Assignee:
Scorpio's Technologies, Inc.
International Classes:
H01S5/02375
Domestic Patent References:
| JP2012151327A | ||||
| JP10200153A | ||||
| JP9061676A | ||||
| JP2006053472A | ||||
| JP2010177539A |
Foreign References:
| US20060093002 | ||||
| US20130051727 | ||||
| US20110085760 | ||||
| US20060104322 |
Attorney, Agent or Firm:
Noriaki Okabe
Jin Aiba
Jin Aiba