Title:
ウエハ積層体及びその製造方法
Document Type and Number:
Japanese Patent JP6614090
Kind Code:
B2
Abstract:
To provide a wafer laminate which permits easy bonding between a support and a wafer, permits easy delamination of a wafer from a support, enables enhanced productivity of a thin wafer, and is suited to production of a thin wafer, and for a method of producing the wafer laminate. The wafer laminate includes a support, an adhesive layer formed on the support, and a wafer laminated in such a manner that its front surface having a circuit surface faces the adhesive layer. The adhesive layer includes a light-shielding resin layer A and a non-silicone thermoplastic resin-coating resin layer B in this order from the support side. The resin layer A is composed of a resin that contains a repeating unit having a condensed ring, and the resin layer B has a storage elastic modulus E' at 25°C of 1 to 500 MPa and a tensile break strength of 5 to 50 MPa.
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Inventors:
Hiroyuki Yasuda
Michihiro Sugo
Hideto Kato
Michihiro Sugo
Hideto Kato
Application Number:
JP2016199819A
Publication Date:
December 04, 2019
Filing Date:
October 11, 2016
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
H01L21/02; B32B7/12; B32B27/00; C09J165/00; C09J201/00; H01L21/304; H01L21/683
Domestic Patent References:
| JP2015191940A | ||||
| JP2014129431A | ||||
| JP2014112618A |
Attorney, Agent or Firm:
Hideaki International Patent Office