Title:
電子装置
Document Type and Number:
Japanese Patent JP6620447
Kind Code:
B2
Abstract:
An electronic device includes: wires; electronic components; a control board connected to the electronic components via the wires, configured to control the electronic components, and having a first surface and a second surface; a first frame opposed to the first surface and supporting the control board; connectors arranged on the second surface of the control board, at least one of the wires each being connected to a corresponding one of the connectors; an insulated member interposed between the first frame and the first surface of the control board in a first direction; and a positioner formed on the insulated member and extending from the insulated member toward the control board in the first direction. The positioner positions at least one specific wire at a position farther from the insulated member than the second surface.
Inventors:
Hiroaki Shigeno
Application Number:
JP2015150942A
Publication Date:
December 18, 2019
Filing Date:
July 30, 2015
Export Citation:
Assignee:
Brother Industries, Ltd.
International Classes:
H05K7/00; G03G21/16; H04N1/00
Domestic Patent References:
| JP2007242690A | ||||
| JP2010258306A | ||||
| JP2012212130A | ||||
| JP2011205341A | ||||
| JP2012189813A | ||||
| JP2009182477A | ||||
| JP62114483U | ||||
| JP56002289U |
Attorney, Agent or Firm:
Patent business corporation Patena