Title:
プローバ及びプローブコンタクト方法
Document Type and Number:
Japanese Patent JP6620990
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a prober and a probe contact method, capable of achieving good contact between an electrode pad on a wafer and a probe in a multi-stage prober.SOLUTION: A prober includes: a wafer chuck 34; a probe card 32; a link-like seal member 48 provided to the wafer chuck 34; a Z-axis moving and rotating section 72 for lifting the wafer chuck 34 that is detachably fixed to a wafer chuck support face 72a; a vacuum electro-pneumatic regulator 54 for depressurizing an internal space formed by the probe card 32, the wafer chuck 34, and the link-like seal member 48; and a timing control means for releasing the fixation of the wafer chuck 34 by the wafer chuck support face 72a at a second timing later than a first timing at which depressurization of the internal space is started.SELECTED DRAWING: Figure 4
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Inventors:
Hideaki Nagashima
Application Number:
JP2016066462A
Publication Date:
December 18, 2019
Filing Date:
March 29, 2016
Export Citation:
Assignee:
Tokyo Seimitsu Co., Ltd.
International Classes:
G01R31/28; H01L21/66
Domestic Patent References:
| JP2014029917A | ||||
| JP2014075420A | ||||
| JP2014150168A |
Attorney, Agent or Firm:
Kenzo Matsuura