Title:
独立駆動式フィルム分離機構
Document Type and Number:
Japanese Patent JP6621874
Kind Code:
B2
Abstract:
The present disclosure relates to an independently-driven film separation mechanism. The separation mechanism includes a mounting platform. A plurality of first suction components for sucking the bottom surfaces of wafers respectively are provided on one side of the mounting platform. The mounting platform is provided with a plurality of second suction components for sucking films respectively, each of the films is provided on a top surface of the corresponding wafer. The first suction components and the second suction components are provided in a one to one correspondence. Each of the second suction components is connected with a driving mechanism and can be driven by the corresponding driving mechanism to move up and down. Each of the driving mechanisms is independently disposed and provided on the mounting platform.
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Inventors:
Wei Min
Application Number:
JP2018124711A
Publication Date:
December 18, 2019
Filing Date:
June 29, 2018
Export Citation:
Assignee:
DONGTAI HI-TECH EQUIPMENT TECHNOLOGY CO., LTD
International Classes:
H01L21/02; H01L21/683
Domestic Patent References:
| JP2012174742A | ||||
| JP2003128490A | ||||
| JP2013207159A | ||||
| JP2013157417A | ||||
| JP2016040099A |
Attorney, Agent or Firm:
Fukami patent office