Title:
フレキシブルプリント配線板並びにこれを用いた集光型太陽光発電モジュール及び集光型太陽光発電パネル
Document Type and Number:
Japanese Patent JP6625250
Kind Code:
B2
Abstract:
To provide a flexible printed wiring board having an insulation substrate that suppresses degradation in withstand voltage performance even in a humid environment, and a photovoltaic power generation module and photovoltaic power generation panel using the same.SOLUTION: A flexible printed wiring board 12 comprises: a film-like insulation substrate 121 having flexibility and a withstand voltage value of at least 2000 V; and a conductor layer 122 formed in the insulation substrate 121 and forming a circuit pattern. The insulation substrate 121 comprises polyimide as its primary component and has a filler percentage content of 0%.SELECTED DRAWING: Figure 3
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Inventors:
Kenji Saito
Yoichi Nagai
Kenichi Hirotsu
Takashi Iwasaki
Hiroyuki Matsuyama
Shogo Asai
Yoichi Nagai
Kenichi Hirotsu
Takashi Iwasaki
Hiroyuki Matsuyama
Shogo Asai
Application Number:
JP2019007770A
Publication Date:
December 25, 2019
Filing Date:
January 21, 2019
Export Citation:
Assignee:
Sumitomo Electric Industries, Ltd.
Arisawa Manufacturing Co., Ltd.
Sumitomo Electric Print Circuit Co., Ltd.
Arisawa Manufacturing Co., Ltd.
Sumitomo Electric Print Circuit Co., Ltd.
International Classes:
H05K1/03; H01L31/048; H01L31/05; H01L31/054
Domestic Patent References:
| JP2013149831A | ||||
| JP62068852A |
Foreign References:
| WO2012165265A1 | ||||
| WO2013054709A1 |
Attorney, Agent or Firm:
Patent Business Corporation Suncrest International Patent Office