Title:
半導体製造装置および半導体製造方法
Document Type and Number:
Japanese Patent JP6625462
Kind Code:
B2
Inventors:
Hiroshi Shiragasawa
Application Number:
JP2016058983A
Publication Date:
December 25, 2019
Filing Date:
March 23, 2016
Export Citation:
Assignee:
LAPIS Semiconductor Co., Ltd.
International Classes:
H01L21/683; H01L21/304
Domestic Patent References:
| JP9266242A | ||||
| JP2012164839A |
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Hiroshi Fukuda
Kato Kazunori
Hiroshi Fukuda