Title:
ウェハ接合用の低温接着性樹脂
Document Type and Number:
Japanese Patent JP6628256
Kind Code:
B2
Abstract:
A method for adhesive bonding in microelectronic device processing is provided that includes bonding a handling wafer to a front side of a device wafer with an adhesive comprising phenoxy resin; and thinning the device wafer from the backside of the device wafer while the device wafer is adhesively engaged to the handling wafer. After the device wafer has been thinned, the adhesive comprising phenoxy resin may be removed by laser debonding, wherein the device wafer is separated from the handling wafer.
Inventors:
Gerorum, Jeffrey
Hahn, Lee Wen
Andrew, Paul
Tsang, Cornelia, Kanui
Knickerbocker, John
Allen, Robert, David
Hahn, Lee Wen
Andrew, Paul
Tsang, Cornelia, Kanui
Knickerbocker, John
Allen, Robert, David
Application Number:
JP2017522935A
Publication Date:
January 08, 2020
Filing Date:
October 19, 2015
Export Citation:
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION
International Classes:
H01L21/304; H01L21/02
Domestic Patent References:
| JP2004064040A | ||||
| JP2007009022A | ||||
| JP2014143308A |
Foreign References:
| WO2014080918A1 | ||||
| WO2007125993A1 | ||||
| US20130213691 |
Attorney, Agent or Firm:
Takeshi Ueno
Tasaichi Tanae
Tasaichi Tanae