Title:
有機ケイ素化合物、硬化性シリコーン組成物、および半導体装置
Document Type and Number:
Japanese Patent JP6628366
Kind Code:
B2
Abstract:
An organosilicon compound represented by the general formula, a hydrosilylation- curable silicone composition containing the compound as an adhesion promoter, and a semiconductor device having a semiconductor element sealed with a cured product of the composition. To provide a novel organosilicon compound, a curable silicone composition that contains the organosilicon compound as an adhesion promoter, has excellent initial adhesion and adhesion durability to a base material such as an organic resin, and forms a cured product having high light transmittance, and a highly reliable semiconductor device produced using this composition.
Inventors:
Tomohiro Iimura
Noda Toda
Inagaki Sawako
Yukinori Miyamoto
Haruhiko Furukawa
Noda Toda
Inagaki Sawako
Yukinori Miyamoto
Haruhiko Furukawa
Application Number:
JP2016523157A
Publication Date:
January 08, 2020
Filing Date:
May 28, 2015
Export Citation:
Assignee:
Dow Toray Co., Ltd.
International Classes:
C07F7/21; C07F7/18; C08L83/04; C08L83/05; C08L83/07; C09J11/06
Domestic Patent References:
| JP2004507513A | ||||
| JP2014062198A | ||||
| JP2000191672A | ||||
| JP2010513664A | ||||
| JP10212409A | ||||
| JP2014077117A |