Title:
溶媒ベースの低温ヒートシールコーティング
Document Type and Number:
Japanese Patent JP6629226
Kind Code:
B2
Abstract:
A low temperature heat seal coating solution which contains an amorphous or semi-crystalline polyester or co-polyester resin, tackifier, anti-blocking agent, and solvent. The coating solution can be applied to a packaging web such as a foil or film by converters using conventional methods such as gravure, rod, slot die, or printing process. The heal seal coating can be sealed to itself or another substrate to manufacture food packaging bags or pharmaceutical blister packaging. The heat seal temperature can be as low as 70° C. under conventional equipment and conditions in the industry.
Inventors:
Darius Kay Dijk
Thomas Lee Rupert
Elaine Law
Thomas Lee Rupert
Elaine Law
Application Number:
JP2016558764A
Publication Date:
January 15, 2020
Filing Date:
March 25, 2015
Export Citation:
Assignee:
Bostik, Inc.
International Classes:
B65D65/40; B32B27/32; B32B27/36; C08J7/043; C08J7/052
Domestic Patent References:
| JP2003176448A | ||||
| JP2004244494A | ||||
| JP2005281421A | ||||
| JP2009511713A | ||||
| JP7040520A | ||||
| JP2013516366A |
Foreign References:
| WO2008008381A2 | ||||
| US20100112250 |
Attorney, Agent or Firm:
Axis International Patent Business Corporation